Le parti elettroniche : MR18R162GAF0-CN9

Produttore : Samsung semiconductor

Imballaggio :

Pins :

Descrizione : (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V

Temperatura : Min °C | Max °C

Datasheet : MR18R162GAF0-CN9 PDF

• MR18R162GAF0
• MR18R162GAF0-CK8
• MR18R162GAF0-CM8
• MR18R162GAF0-CN9
• MR18R162GAF0-CT9