Le parti elettroniche : M368L3324BT

Produttore : SAMSUNG[Samsung semiconductor]

Imballaggio :

Pins :

Descrizione : SDRAM Unbuffered Module 184pin Unbuffered Module based 512Mb B-die with 64/72-bit ECC/ECC TSOP-II

Temperatura : Min °C | Max °C

Datasheet : M368L3324BT PDF

• M368L3313DTL
• M368L3313DTL-CA2
• M368L3313DTL-CB0
• M368L3313DTL-CB3
• M368L3324BT
• M368L3324BTM-CB3
• M368L3324BTM-CCC
• M368L3324BTM-LB3
• M368L3324BTM-LCC
• M368L3324BUM-CB3
• M368L3324BUM-CCC
• M368L3324BUM-LB3
• M368L3324BUM-LCC
• M368L3324CUS-CLCC
• M368L3324DUS