Le parti elettroniche : M368L3324BTM-LB3

Produttore : SAMSUNG[Samsung semiconductor]

Imballaggio :

Pins :

Descrizione : SDRAM Unbuffered Module 184pin Unbuffered Module based 512Mb B-die with 64/72-bit ECC/ECC TSOP-II

Temperatura : Min °C | Max °C

Datasheet : M368L3324BTM-LB3 PDF

• M368L3324BT
• M368L3324BTM-CB3
• M368L3324BTM-CCC
• M368L3324BTM-LB3
• M368L3324BTM-LCC